Flight controllers at Nasa working out how to get the crippled Apollo 13 back to Earth.
Фото: Toby Melville / Reuters
，更多细节参见51吃瓜
从设计角度看，EMIB-T不再局限于简单的2.5D互连，而是向3D封装技术Foveros靠拢，使得在更大芯片尺寸下实现高密度集成成为可能，为未来异构计算平台提供灵活封装架构。
What is the answer to Connections todayBackstabber: JUDAS, SNAKE, TRAITOR, TURNCOAT